Vendors
News

21.08.2017

BOM Connector 7.6 Released
Version 7.6 of BOM Connector, 2016 winner of the prestigious “IT Innovation” from the German government, is now ready for download. This new version has significant improvements in in both the price calculation and BOM processing areas.
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News

17.08.2017

Mentor announces first annual FloTHERM Award
Mentor, a Siemens business, announced its call for entries for its first annual FloTHERM® Delta TJ Award for Excellence in Electronics Thermal Design. The FloTHERM solution has been, for over 30 years, the de facto computational fluid dynamics (CFD) tool for electronics cooling, used to predict airflow, temperature, and heat transfer in components, boards, ...
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News

20.07.2017

Release of FloTHERM v12
The FloTHERM product includes Command Center, which allows users to understand the product design space by defining variations of the base models. The Command Center design window streamlines the interface and user work to achieve productivity gains.
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Events

24.08.2017

Coatings and Potting - A Critical Update
This webinar, presented by Greg Caswell, will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure ...
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Events

19.09.2017

FPGA World 2017
The FPGAworld Conference is an international forum for researchers, engineers, teachers, students and hackers. It covers topics such as complex SW/HW embedded systems, FPGA based products, educational & industrial cases and more. The academic & industrial tracks at FPGAworld, meals, premises, administration etc. is paid for by industry sponsors and e...
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Events

21.09.2017

Web Seminar: PADS Professional ECAD-MCAD
These days it is more important than ever for ECAD and MCAD engineers to collaborate throughout the entire product design cycle. Printed circuit board designs, mechanical enclosures, and related components need to mate, fit, and be correct by design to eliminate re-spins, get designs to market quicker, and minimize production costs. At this webinar you will ...
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