MicReD

MicReD Products

Thermally test, measure and characterize semiconductor devices (including LEDs), TIMs and even complete electronic systems

The MicReD® (Microelectronics Research and Development) family of hardware and software products enables component and systems suppliers to accurately and efficiently thermally test, measure and characterize integrated circuit packages, single and arrayed LEDs, stacked and multi-die packages, power electronics, thermal interface materials (TIMs), and complete electronic systems. MicReD was a spin-off company created by researchers at the Department of Electron Devices at the Budapest University of Technology & Economics (BME).

 

Products

 

T3Ster

Transient thermal test, measurement and characterization of ICs, LEDs and assorted packages. More ►


TeraLED

Thermal and Radiometric/Photometric measurement of LEDs and LED arrays. More ►


DynTIM

Thermal characterization of thermal interface materials. More ►


Power Tester 1500A
Thermal test and power cycling of IGBTs. More ►


MicReD Hardware Family

MicReD products are used in the semiconductor, consumer electronics, transportation and LED industries. Customers include Bosch and Automotive Lighting as well as many world-leading semiconductor manufacturers such as IBM, Infineon, LG, Philips, ST Microelectronics, Siemens and Samsung and specialist universities/research centers.

 

MicReD’s highly acclaimed hardware is also widely used in the optical field at world renowned companies and research centers such as Denso, Toyota, Lumileds, and Osram as well as KOPTI (Korea) and ITRI (Taiwan).

 

  • Fast and accurate transient thermal test, measurement and characterization of IC packages, LEDs, LED arrays and systems.
  • Full support of the transient dual interface method (JEDEC JESD51-14) and the latest LED thermal testing standards (e.g. JEDEC JESD51-51, 51-52).
  • Create compact thermal models for accurate thermal simulation in FloTHERM.
  • Non-destructive failure detection of IC packages and LEDs - used e.g. as a post-stress test method in reliability analysis.