Suitability of Copper Wire Bonded ICs for High Reliability/Harsh Environment Electronics

Suitability of Copper Wire Bonded ICs for High Reliability/Harsh Environment Electronics

The transition to replace gold with copper bond wires in semiconductor components, primarily driven by the ever increasing price of gold wire, has been under way for several years. Cu wire bonds (Cu-WBs) are technically more challenging than gold to produce, requiring improved designs, processes and equipment. After introduction in consumer products, their use is now migrating to automotive and other HI-REL electronics products where product integrity for quality, reliability and durability (QRD) and safety over 10-25 years in a demanding harsh environment is paramount, in addition to managing cost in the highly competitive global automotive market.

 

This webinar will review the potential concerns of using Cu-WB ICs in HI-REL products from a science based Physics of Failure perspective and provide recommendation and best practices for mitigating risks.
 

Details

What

Suitability of Copper Wire Bonded ICs for High Reliability/Harsh Environment Electronics

When Thursday the 28th of May 2015
Presenter   Jim McLeish
Where Online
Time 5:00 - 6:15 PM CEST  - Register
Time 8:00 - 9:15 PM CEST  - Register