System Level Effects on Solder Joint Reliability

System Level Effects on Solder Joint Reliability

Electronic systems may often fail, not because of poorly designed chips, substrates or other components, but because of the failure of the solder joints that link them all together. The mismatch between PCB solder materials can result in thermal expansion problems including excessive strain, cracking and open circuits. The impact of thermal fatigue, soldering defects, vibration and residual strains must be considered when analyzing solder reliability. These and other issues are often exposed in accelerated stress tests.

The most common method for testing solder joint reliability is thermal cycling where the thermal modulation process mimics environmental strains. But other testing methods including power cycling, HALT, shock and vibration can expose potential metallurgical and physical failures.

In this webinar DfR Solutions Research Engineer, Maxim Serebreni, PhD, will discuss Thermo-mechanical fatigue of solder interconnects, shear and tensile effects, glass style, improper conformal coating, and mirroring on solder fatigue. He will also review the Physics of Failure methodology and solder alloy selection approach.

Dr. Serebreni is an expert in experimental mechanics and mechanical characterization of non-ferrous metallic alloys.




System Level Effects on Solder Joint Reliability


Thursday the 17th of August 2017





11 am EDT or 2 pm EDT