Guaranteeing Reliability with Thermal Cycling

Guaranteeing Reliability with Thermal Cycling

This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided. We will discuss the usage of analytical and semi-analytical prediction methodologies.

 

Details

What

Guaranteeing Reliability with Thermal Cycling


Presenter

Nathan Blattau

 

When

Tuesday the 10th of September 2015

  • 5:00 PM - 6.30 PM CEST
  • 8:00 PM - 9.30 PM CEST

 

Where

Online