This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided.
We will discuss the usage of analytical and semi-analytical prediction methodologies.
What
Webinar: Guarantee Reliability with Thermal Cycling
When
Thursday, the 14th of December 2017
Where
Online
Register
EDA
Electrical & Wire Harness Design
Electronic System level Design
Support
ALM
PLM
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Vendors
InnoFour
Twentepoort Oost 61-02
7609 RG Almelo
The Netherlands
tel +31 546 454 530
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