Guarantee Reliability with Thermal Cycling

This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided.

We will discuss the usage of analytical and semi-analytical prediction methodologies.

Details

What

Webinar: Guarantee Reliability with Thermal Cycling

When

Thursday, the 14th of December 2017

Where

Online

Register

11AM Session or 2PM Session