The Impact of Underfill on Thermal Fatigue of 2nd Level Solder Interconnects Under Mean Temperature

The Impact of Underfill on Thermal Fatigue of 2nd Level Solder Interconnects Under Mean Temperature

With the larger size of Ball Grid Array (BGA) solder joints, the available volume for underfilling is significantly increased. Although the size of the solder joints and package dimension governs the volume of underfill material, the larger 2nd level solder interconnects are more susceptible to thermal fatigue with certain underfills and thermal profiles.

 

In this webinar we will discuss a study of BGA packages that were underfilled with two dedicated underfill materials and two soft materials used as conformal coatings and encapsulants in electronic products. We will review the factors associated with reduced fatigue endurance of certain underfill materials under temperature profiles with mean temperature conditions and contribute to the development of new criteria of underfill material selection for 2nd level interconnects.

 

Details

What

The Impact of Underfill on Thermal Fatigue of 2nd Level Solder Interconnects Under Mean Temperature

 

When

Thursday the 25th of October 2018

 

Where

Online

 

Register

11:00 AM EST