Analyzing Via to Via Coupling Through PDN Cavities Using HyperLynx PDN Editor

Analyzing Via to Via Coupling Through PDN Cavities Using HyperLynx PDN Editor

 

Overview

At today’s signaling edge rates, crosstalk between vias passing through power/ground plane cavities can no longer be ignored.

 

This webinar explains the main root cause behind the via to via coupling phenomena. HyperLynx PDN Editor in Linesim is used to analyze how coupling occurs and how significant the crosstalk noise might be.

 

The Decoupling Wizard will be used for frequency domain analysis of the impedance profile of the PDN. Also, time domain simulations using the SI/PI Co-Simulation feature is performed to help the user understand the impact of this crosstalk noise.

 

Finally, the current mitigating techniques are evaluated to see how efficient they might be in reducing this crosstalk noise.

 

What You Will Learn

  • Root cause behind via to via coupling
  • Geometry creation of cavity with IC probes and vias.
  • Frequency domain analysis of a cavity impedance profile using the Decoupling Wizard
  • Time domain simulation of via to via coupling
  • Techniques to mitigate coupling effects

 

Who Should Attend

  • Electrical Hardware Design Engineers
  • Power Integrity Engineers
  • Signal Integrity Engineers
  • PCB Design Engineers
  • Board Layout Designers
  • HyperLynx users

 

Details

What

Analyzing Via to Via Coupling Through PDN Cavities Using HyperLynx PDN Editor

 

When

Thursday the 29th of November 2018

 

Where
Online

 

Time

6:00 PM - 6:30 PM