The Reliability of BGA, QFN and Other Critical Packages

The Reliability of BGA, QFN and Other Critical Packages

There are many factors that determine the thermal cycling robustness of an electronic package. Packages that have known thermal cycling issues include BGAs, QFNs and ceramics.

 

In this presentation, Nathan will discuss the critical parameters of these packages that may affect the thermal cycling performance. The webinar will also cover other possible reasons why your electronic product may not be robust with regards to thermal cycling.

 

Key Takeaways:

  • Review the package types that are the most susceptible thermal cycling fatigue
    • BGA packages
    • QFN packages
    • Ceramic components
    • Effects of lead frame material on plastic packages
  • Other factors to consider when designing a thermal cycling robust electronic product

 

Details

What

Web Seminar: The Reliability of BGA, QFN and Other Critical Packages

 

When

Thuesday the 30th of April 2019

 

Where

Online

 

Register

11:00 AM EST