Three new versions of HyperLynx SI introduced

Mentor Graphics: Three new versions of HyperLynx SI introduced


Mentor Graphics recently announced three new versions of HyperLynx, HyperLynx EXS, HyperLynx DRC and HyperLynx 3D EM SSD to complete their line of HyperLynx Suites. Below you will find high lights of the individual products and for more information please contact us.


HyperLynx EXS : This is the new entry point for the HyperLynx family suites. HyperLynx EXS is the perfect tool for getting started with SI analysis and a perfect match for PADS Suites and PADS bundles without any SI analysis at all.


HyperLynx EXS features:

  • Native IBIS simulation
  • Visual IBIS Editor
  • Oscilloscope simulation control
  • Stack-up editor and Field Solver
  • X-talk analysis

HyperLynx EXS is available in both perpetual version with a USB and it is possible to rent the software for very short periods.


HyperLynx DRC : Computerized inspection of the printed circuit board design is like basic triage. It helps customers quickly find areas for concern based on the type of net (e.g. clocks, strobes), showing them where more-detailed analysis is required. This type of inspection also finds problems that are not well addressed by simulation. A good example is EMI.


HyperLynx DRC allows customers to capture their design engineers' IP and share it across an organization. This makes designer reviews repeatable, efficient, and consistent, saving the customer significant development time. (DRC.png)




HyperLynx 3D EM S SD : HyperLynx 3D EM is a design and verification solution intended to detect customers' most complex electrical design problems with a full-wave 3D electromagnetic simulator. Full 3D geometry capabilities accurately model every trace, bump, bend, turn, and layer transition of high-speed data paths for use in SI/PI analysis of PCBs, packaging, RFICs, MMICs, and planar antenna designs.

Who would benefit from HyperLynx PI 3D EM: HyperLynx 3D EM SSD is a high-capacity electromagnetic design and verification solution targeting small- to medium-size high-frequency circuits such as:

  • Monolithic microwave integrated circuits (MMICs)
  • Radio-frequency integrated circuits (RFICs)
  • Low-temperature co-fired ceramic (LTCC) circuits
  • High-temperature superconducting (HTS) circuits
  • Most RF and wireless antennas, including:
  • Radio-frequency identification (RFID) antennas
  • Patch antennas
  • Slot antennas
  • Wire antennas.

Target Audience:

  • Designed for single users with small structures that can be easily entered through the MGrid layout editor
  • No data import from CAD layout.
  • Generally applies only to small accounts with individual needs. (GDC)
  • HyperLynx 3D EM SSD is a subset of HL 3D EM Engine + Designer.
  • Large enterprise customers should be directed to HL 3D EM Engine + Designer.
  • SSD does not support distributed simulation; it can be used by only one designer at a time.

Key Benefits:

  • Accurate simulation results that match measurement reduces EM design costs by avoiding expensive design iterations
  • Efficient mesh generation shrinks the required memory footprint for even the largest structures reducing EM design risks through precise geometry modeling
  • Fast, full-wave 3D EM simulation engine speeds up design convergence and improves overall design quality by verifying more design issues in less time
  • The EM engine supports multi-core computers to increase simulation throughput without additional costs or setup.















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