Do you have control over your PCB quality?

Do you have control over your PCB quality?

PADS flow for quality with DFM Analysis


You may get feedback from your PCB fabricator or Assembly company about the PCB needs to be changed to some extent. Either the PCB manufacturer changes the desig og his tool to fix problems regarding his process and/or the Assembly company has to fix something that is costly and time consuming. Often the changes are done without feeding the data back to you. In this case these changes will be done over and over again in different instances.

DFM Analysis within the PADS flow identifies manufacturing issues.


Be aware of the processes that will follow after you are done designing your PCB Layout.

If the layout is checked for these issues during the design work, you can minimize Manufacturing delays and Layout spins. You will raise the board quality plus the manufacturer will be sent more correct data. It’s also easier to switch manufacturers because you now have more control over the product quality. The data that exist in PADS with DFM Analysis will be more alike the end result.


PADS flow and checking for quality with DFM Analysis.

In the new release of PADS, Mentor Graphics has added possibilities to check for these issues. PADS have design rules built in and now with DFM Analysis, you can check for over 100 of the most valuable fabrication and assembly related issues.  See a few of them below. 


DFM Analysis within the PADS Flow automatically displays manufacturing related challenges within both products, allowing quick corrections within the layout.


Examples of common manufacturability challenges identified by DFM Analysis, copper neckdown, test point density, lack of power connection and resist slivers.


World Class DFM Analysis .

DFM Analysis verifies the manufacturability of a design from the suppliers’ point of view by identifying challenges often overlooked by today’s design rules checking. In addition to the critical manufacturing copper spacing related DFM Analysis, there are additional manufacturing focused analyses performed including, thermal connect reduction, copper slivers, insufficient solder mask coverage, line neck down, test point density, extra solder paste, component spacing validation, and much more. This comprehensive DFM Analysis approach allows production release of a design while minimizing the possibility of manufacturing objections and resulting delays.