What's new in Xpedition IC Packaging VX.2.10

06 October 2021

Expert Series: What's new in Xpedition IC Packaging VX.2.10

 

 

Xpedition IC Packaging VX.2.10 delivers capabilities targeted at the prototyping and planning of next-generation 2.5/3D heterogeneous packages.

 

What You Will Learn

New capabilities associated with Xpedition Substrate Integrator and Xpedition Package Designer:

  • Performance and design capacity support for ultra-high pin count devices
  • System-level predictive SI/PI analysis during prototyping and planning
  • Streamlined co-existence of mixed vendor design flows

 

Who Should Attend:

  • New & experienced Xpedition IC Packaging users

 

Products Covered:

  • Xpepditon Substrate Integrator
  • Xpedition Package Designer
  • HyperLynx DRC
  • Hyperlynx FAST 3D

 

 

Details


What
Customer Only Live webinar: What's new in Xpedition IC Packaging VX.2.10

 

When
Wednesday the 6th of October 2021

 

Where
Online

 

Time
18:00 hr CEST