Expert Series: What's new in Xpedition IC Packaging VX.2.10
Xpedition IC Packaging VX.2.10 delivers capabilities targeted at the prototyping and planning of next-generation 2.5/3D heterogeneous packages.
What You Will Learn
New capabilities associated with Xpedition Substrate Integrator and Xpedition Package Designer:
- Performance and design capacity support for ultra-high pin count devices
- System-level predictive SI/PI analysis during prototyping and planning
- Streamlined co-existence of mixed vendor design flows
Who Should Attend:
- New & experienced Xpedition IC Packaging users
Products Covered:
- Xpepditon Substrate Integrator
- Xpedition Package Designer
- HyperLynx DRC
- Hyperlynx FAST 3D
Details
What
Customer Only Live webinar: What's new in Xpedition IC Packaging VX.2.10
When
Wednesday the 6th of October 2021
Where
Online
Time
18:00 hr CEST
