12 November 2020

 

What's new in Xpedition IC Packaging VX.2.8

 

Overview

Learn about the new powerful, productive and differentiated capabilities of the Xpedition IC Packaging VX.2.8 release.

 

What You Will Learn

  • Faster prototyping/planning including very large design support
  • Enhanced advanced IC package layout support
  • Optimized high-yield manufacturing output

 

Details

What
Live customer webinar: What's new in Xpedition IC Packaging VX.2.8

 

When

Thursday the 12th of November 2020

 

Where

Online

 

Time

6:00 PM till 7:00 PM CEST