What's new in Xpedition IC Packaging VX.2.8
Learn about the new powerful, productive and differentiated capabilities of the Xpedition IC Packaging VX.2.8 release.
What You Will Learn
- Faster prototyping/planning including very large design support
- Enhanced advanced IC package layout support
- Optimized high-yield manufacturing output
Live customer webinar: What's new in Xpedition IC Packaging VX.2.8
Thursday the 12th of November 2020
6:00 PM till 7:00 PM CEST
During this web seminar, we will take you through the process of using PartQuest with VX2.7, creating symbols and footprints if not already available, and how data is added to your design and libraryEDM Library: Using data from the Components class to populate the Manufacturer and Manufacturer Part classes
This material will cover the process used to extract manufacturer name and manufacturer part number information from Component object characteristics, manipulate that information, and import it into the Manufacturer and Manufacturer Part classes of the EDM Library data model.