What's new in Xpedition IC Packaging VX.2.8

12 November 2020

What's new in Xpedition IC Packaging VX.2.8

Overview

Learn about the new powerful, productive and differentiated capabilities of the Xpedition IC Packaging VX.2.8 release.

What You Will Learn

Faster prototyping/planning including very large design support
Enhanced advanced IC package layout support
Optimized high-yield manufacturing output

Details

What
Live customer webinar: What's new in Xpedition IC Packaging VX.2.8

When

Thursday the 12th of November 2020

Where

Online

Time

6:00 PM till 7:00 PM CEST

Build your Central Library with millions of parts using PartQuest

During this web seminar, we will take you through the process of using PartQuest with VX2.7, creating symbols and footprints if not already available, and how data is added to your design and library

Back to overview

EDM Library: Using data from the Components class to populate the Manufacturer and Manufacturer Part classes

This material will cover the process used to extract manufacturer name and manufacturer part number information from Component object characteristics, manipulate that information, and import it into the Manufacturer and Manufacturer Part classes of the EDM Library data model.