Z-planner Enterprise optimizes the process of defining stackup requirements and documenting those requirements early in the design process, ensuring that pre-layout signal-integrity simulations are based on the most accurate laminate data available using a consistent stackup design methodology.
Z-planner Enterprise enhances the stackup design process by providing an accurate field solver, a loss-planning environment, and a complete dielectric materials library – all seamlessly interfaced within an intuitive signal-integrity layout. This allows users to model the most accurate stackup possible from the start. Model dual-side copper roughness, calculate trace widths based on material glass-weave and optimize sequential lamination.