The latest releases of HyperLynx address the increasing complexity of today’s advanced system designs through an emphasis on both ease-of-use and team productivity.
Note: The following is a condensed summary of the HyperLynx release highlights. Mentor customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.
- 3D Explorer Enhancements
- Crosstalk-Aware 3D Post-Route Extraction
- EDM Integrationnn
- Xpedition & PCB Flow Improvements
- HyperLynx DRC Improvements
For more information please call us or send us an email info@innofour.com
The latest releases of Xpedition address the increasing complexity of today’s advanced system designs through an emphasis on both ease-of-use and team productivity.
What’s New in Xpedition IC PackagingMentor's Xpedition IC Packaging tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design.