What’s New in Xpedition IC Packaging

10 March 2020

Mentor's Xpedition IC Packaging tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design.


Note: The following is a condensed summary of the Xpedition release highlights. Mentor customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.


  • Advanced Prototyping Optimization
  • Differential Pairs Flow Support
  • ODB++ teardrops import
  • Rout Obstruct Areas
  • Manual Saw Tuning
  • Sequential Multi-part Floorplanning
  • Clearance Rules to NC Pins


For more information please call us or send us an email info@innofour.com