Mentor's Xpedition IC Packaging tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design.

Note: The following is a condensed summary of the Xpedition release highlights. Mentor customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.

• Advanced Prototyping Optimization
• Differential Pairs Flow Support
• ODB++ teardrops import
• Rout Obstruct Areas
• Manual Saw Tuning
• Sequential Multi-part Floorplanning
• Clearance Rules to NC Pins

For more information please call us or send us an email info@innofour.com