10 March 2020

Mentor's Xpedition IC Packaging tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design.


Note: The following is a condensed summary of the Xpedition release highlights. Mentor customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.


  • Advanced Prototyping Optimization
  • Differential Pairs Flow Support
  • ODB++ teardrops import
  • Rout Obstruct Areas
  • Manual Saw Tuning
  • Sequential Multi-part Floorplanning
  • Clearance Rules to NC Pins


For more information please call us or send us an email info@innofour.com