Mentor's Xpedition IC Packaging tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design.
Note: The following is a condensed summary of the Xpedition release highlights. Mentor customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.
- Advanced Prototyping Optimization
- Differential Pairs Flow Support
- ODB++ teardrops import
- Rout Obstruct Areas
- Manual Saw Tuning
- Sequential Multi-part Floorplanning
- Clearance Rules to NC Pins
The latest releases of HyperLynx address the increasing complexity of today’s advanced system designs through an emphasis on both ease-of-use and team productivity.New build release CAM350 and BluePrint
DownStream has released a new installation exe for the previous releases of CAM350 12.2 & BluePrint 5.2.