Mentor's Xpedition IC Packaging tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design.
Note: The following is a condensed summary of the Xpedition release highlights. Mentor customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.
- Advanced Prototyping Optimization
- Differential Pairs Flow Support
- ODB++ teardrops import
- Rout Obstruct Areas
- Manual Saw Tuning
- Sequential Multi-part Floorplanning
- Clearance Rules to NC Pins
For more information please call us or send us an email info@innofour.com
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