Simcenter Flotherm

Perform thermal analysis, create virtual models, and test design modifications of electronic equipment before physical prototyping

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  • Uses advanced CFD techniques to predict airflow, temperature, and heat transfer
  • Tthe industry's best solution for integration with MCAD and EDA software

Simcenter Flotherm

Simcenter Flotherm uses advanced CFD techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems, including racks and data centers. It's also the industry's best solution for integration with MCAD and EDA software.

Simcenter Flotherm is the undisputed world leader for electronics thermal analysis, with a 98 percent user recommendation rating. It supports more users, application examples, libraries and published technical papers than any competing product.

Accelerated Thermal Design Workflow

Simcenter Flotherm integrates with popular MCAD and EDA tools. Its XML import capability simplifies building and solving models, post-processing results automatically. Simcenter Flotherm's automatic sequential optimization and DoE capabilities reduces the time it takes to reach optimized design, allowing it to be deeply embedded in the design flow.

Robust Meshing and Fast Solver

Simcenter Flotherm lets engineers focus on design, delivering the most accurate results possible within engineering timescales. Its SmartParts and structured-Cartesian method offers the fastest solution time per grid cell. The Simcenter Flotherm “localized-grid” technique supports integrally matched, nested, non-conformal grid interfaces between different parts of the solution domain.

Usability and Intelligent Thermal Models

Integral model checking in Simcenter Flotherm lets users see which objects have attached material, the power attached to every object, and corresponding assembly-level power dissipation. It also identifies whether the object is creating a mesh line.

Simcenter Flotherm SmartParts represent ICs to full racks of electronics from a large list of suppliers, streamlining model creation to minimize solve times and maximize solution accuracy.

Thermal Characterization and Analysis from Component to System

Combine Simcenter Flotherm with T3Ster transient thermal characterization for thermal simulation of real-world electronics. Since reliability of components can decrease exponentially due to heat problems, using T3Ster lets manufacturers design chips, ICs, and PCBs of superior thermal performance. They can also publish reliable thermal data for downstream applications.

Now Simcenter Flotherm can convert a simulated transient thermal response into a structure function curve using the same mathematical process utilized by T3Ster. These structure function curves are known to correlate with the physical structure of the device, and are thus the ideal platform to compare simulation results with actual test data. Simcenter Flotherm’s Command Center now provides automated calibration of the package thermal model to match the T3Ster results, ensuring the correct thermal response irrespective of the length of the power pulse. Equipment manufacturers and systems integrators can now use calibrated models to design even more reliable products, avoiding thermally-induced failures throughout the product’s lifetime.

Whitepaper

Achieve higher accuracy in electronics cooling simulation with measurement and calibration.

This whitepaper considers factors for higher accuracy for modeling trace and connection heat dissipation within simulation. It illustrates thermal measurement of an IGBT module using Simcenter T3STER and model calibration in conjunction with thermal simulation in Simcenter Flotherm.

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Technical specifications

Simcenter Flotherm uses advanced CFD techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems including racks and data centers. It features the industry's best solution for integration with MCAD and EDA software.

all technical specifications

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