Xpedition Enterprise

Multi-Discipline Systems Engineering

Concurrent engineering has been proven to reduce design cycle time by 40 to 70 percent for even the most complex PCBs. Additional benefits include competitive differentiation, improved time to market, reduced product development cost, and improved design quality.

Xpedition delivers integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA and MCAD to ensure teams have the flexibility and intuitive technologies they need.

i want to know more about multi-discipline systems engineering

Avoid redundant and error-prone data re-entry to reduce product risk
Capture design details in intelligent design system rather than office tools
Manage different system hardware architectures together with the final PCB implementation
Automatically synchronize changes across multiple boards and cables
Trace connectivity from system schematic through all PCBs

Multi-Board Design

Improve team efficiency with an automated workflow for multi-board system definition, partitioning and integration of individual board designs.

ECAD/MCAD Co-Design

Collaborate effectively between ECAD and MCAD domains to optimize electrinics within tight form-factor constraints while still meeting quality, reliability and performance requirements.

FPGA/PCB Co-Design

Eliminate the barriers between FPGA and PCB design organizations, enabling concurrent design processes with greater accuracy and speed. Optimize the FPGA I/O in the context of the PCB layout.

IC Packaging/PCB Co-Design

Address high density advanced package (HDAP) rapid prototyping assembly, physical design, verification, signoff and modeling — co-designed in context with the ICs and PCBs in the electronics system.

A/D/RF Co-Design

Concurrently design RF circuits in the context of the entire PCB, ensuring optimal density and minimal interference. Dynamically integrate with industry RF simulation tools to reduce design cycles.

PCB/Harness Co-Design

Ensure accurate connectivity in systems interconnected via cables by co-designing them with the multi-board hardware. Optimize cabling to ensure optimal performance of the complete system.

Multi-board system design

The last decade has seen extraordinary advances in printed circuit board design and fabrication. There has been substantial advances across design, from schematic entry to simulation to layout and routing to team collaboration and even to the way that manufacturing data is transferred to the fabricator.

But there is one place where advancement has seemingly been stalled: the overarching system level hardware architecture design and connectivity.