Concurrent engineering has been proven to reduce design cycle time by 40 to 70 percent for even the most complex PCBs. Additional benefits include competitive differentiation, improved time to market, reduced product development cost, and improved design quality.
- Avoid redundant and error-prone data re-entry to reduce product risk
- Capture design details in intelligent design system rather than office tools
- Manage different system hardware architectures together with the final PCB implementation
- Automatically synchronize changes across multiple boards and cables
- Trace connectivity from system schematic through all PCBs
Improve team efficiency with an automated workflow for multi-board system definition, partitioning and integration of individual board designs.
Collaborate effectively between ECAD and MCAD domains to optimize electrinics within tight form-factor constraints while still meeting quality, reliability and performance requirements.
Eliminate the barriers between FPGA and PCB design organizations, enabling concurrent design processes with greater accuracy and speed. Optimize the FPGA I/O in the context of the PCB layout.
IC Packaging/PCB Co-Design
Address high density advanced package (HDAP) rapid prototyping assembly, physical design, verification, signoff and modeling — co-designed in context with the ICs and PCBs in the electronics system.
Concurrently design RF circuits in the context of the entire PCB, ensuring optimal density and minimal interference. Dynamically integrate with industry RF simulation tools to reduce design cycles.
Ensure accurate connectivity in systems interconnected via cables by co-designing them with the multi-board hardware. Optimize cabling to ensure optimal performance of the complete system.