Simcenter FLOEFD enables thermal engineers and designers to work in the CAD environment to accelerate thermal design – for electronics cooling simulation to thermo-mechanical stress analysis.
Highlighted features include design stage appropriate options for thermal analysis of printed circuit boards (PCBs) from simple, detailed (layered) to explicit copper trace. The SmartPCB option, a computationally efficient modeling network assembly approach, does not sacrifice accuracy for thermal modeling that also supports electro-thermal co-simulation tasks and thermo-mechanical stress analysis. The Simcenter FLOEFD EDA Bridge supports easy PCB data import from all major EDA software file formats. Package modeling options including 2-Resistor, network assembly, and detailed models. It is possible to create these with all internal geometric elements included, in just minutes using the Package Creator utility.
Further capabilities include transient modeling and measurement calibration (with Simcenter Micred T3STER) to achieve the highest accuracy. Additionally, BCI-ROM technology enables you to generate reduced order models from 3D analysis for use in electrothermal circuit simulation and system simulation tools.
Learn about streamlining PCB thermal and thermo-mechanical analysis in this on-demand webinar.