Enhance electronics reliability with a streamlined simulation and test approach

Increasing semiconductor content is an emerging trend across consumer electronics, automotive and aerospace industries. The latest packaging technologies integrate increasingly high computing power in a single package, creating thermal and mechanical design challenges at both the package and PCB board levels.

Power conversion components, such as electric traction applications, are changing too. They switch increasing amounts of power while maintaining the same package footprints. Thermal, shock and vibration-related reliability of the PCB or the component is concerning.

This on demand webinar demonstrates how to import ECAD data into the mechanical environment and use simulation tools to support thermal, structural, and modal analysis of the board or subsystem. Watch a test-based approach that can calibrate the thermal model of selected high-power components while also estimating the power cycling lifetime.

You'll learn how:

• Electrical and mechanical engineers can work together to validate early designs virtually
• Designers can perform simple yet accurate CFD analysis of electronic systems
• To perform structural and modal analysis of PCB designs
• Testing can further increase the accuracy of modeling and help calibrate material parameters

Discover how a seamless ECAD-MCAD flow increases early design fidelity and allows for innovation in less time at a lower cost. The key benefits of integrated ECAD-MCAD simulation tools for electronics design are:

• Seamless ECAD-MCAD data transfer
• Users can model the complexity with high fidelity using fewer clicks
• Benefit from an automated hex-dominant mesher
• Gain access to a variety of solution types under a streamlined simulation file

Call or email us if you want to know more about simulation software.