BOM Connector 8 Released
BC8, the latest version of our award winning BOM and Quoting accelerator tool, has been released and is available for immediate download. BOM Connector Version 8 is a substantial performance upgrade.

Xpedition® - VX.2.4 Released
The latest releases of Xpedition address the increasing complexity of today’s advanced system designs through an emphasis on both ease-of-use and team productivity.

PADS VX.2.4. released
PADS VX.2.4 is now available for download on SupportCenter. This release introduces the new PADS Pro DS Suite, with the addition of pre-layout SI analysis and AMS to both DS Suites, and core improvements to all products.

Reliability Modeling and Simulation of Commercial-Off-The-Shelf (COTS) Assemblies Using Sherlock
This webinar will provide a live demonstration of how a COTS PCBA can be assessed using Sherlock Automated Design Analysis™ software, given only a physical sample and no design information.

The Impact of Underfill on Thermal Fatigue of 2nd Level Solder Interconnects Under Mean Temperature
In this webinar we will discuss a study of BGA packages that were underfilled with two dedicated underfill materials and two soft materials used as conformal coatings and encapsulants in electronic products.

Design Automation & Embedded Systems 2018 - Mechelen
We invite you to visit D&E Event in Mechelen and attend the interesting presentation about Polarion.