BOM Connector 8 Released
BC8, the latest version of our award winning BOM and Quoting accelerator tool, has been released and is available for immediate download. BOM Connector Version 8 is a substantial performance upgrade.

Xpedition® - VX.2.4 Released
The latest releases of Xpedition address the increasing complexity of today’s advanced system designs through an emphasis on both ease-of-use and team productivity.

PADS VX.2.4. released
PADS VX.2.4 is now available for download on SupportCenter. This release introduces the new PADS Pro DS Suite, with the addition of pre-layout SI analysis and AMS to both DS Suites, and core improvements to all products.

The Impact of Underfill on Thermal Fatigue of 2nd Level Solder Interconnects Under Mean Temperature
In this webinar we will discuss a study of BGA packages that were underfilled with two dedicated underfill materials and two soft materials used as conformal coatings and encapsulants in electronic products.

Design Automation & Embedded Systems 2018 - Mechelen
We invite you to visit D&E Event in Mechelen and attend the interesting presentation about Polarion.

Design Automation & Embedded Systems 2018 - Eindhoven
We invite you to visit D&E Event in Eindhoven and attend the interesting presentation about Polarion.