Bridging Connectivity and Thermal Modeling: i3D Integration with Calibre 3DThermal
Join us at this free Expert Series Webinar to discover how Innovator3D IC integrates seamlessly with Calibre 3DThermal, enabling a unified, efficient, and accurate early thermal analysis flow for advanced 2.5D and 3D IC designs.
In this session, we’ll demonstrate how Innovator3D IC Integrator simplifies early thermal planning by allowing designers to define power maps, materials, and boundary conditions, even before the physical layout is available. You’ll learn how these early design inputs flow directly into Calibre 3DThermal, where Siemens’ industry-leading thermal engine (Simcenter Flotherm) performs fast and precise thermal simulation for stacked dies, interposers, and complex multi-die assemblies.
We will explore how this integrated workflow helps designers build reliable thermal models, validate temperature gradients, and identify hotspots early in the development cycle. By combining system-level connectivity planning in i3D with die-level thermal signoff in Calibre 3DThermal, engineering teams can accelerate feasibility analysis, improve design prediction accuracy, and streamline multi-physics verification.
What You Will Learn:
- Overview of Innovator3D IC and key thermal-related features
- Early thermal planning using power maps, material setup, and boundary conditions
- i3D integration and data exchange with Calibre 3DThermal
- Automated EFFP-based extraction for accurate die-level thermal modeling
- Running static and transient thermal analysis in Calibre 3DThermal
- Live demo of the complete integration flow
Who Should Attend:
- 3D IC, advanced packaging, thermal, and system-level designers
- CAD, verification, and design-enablement engineers
- Architects exploring integrated thermal/physical verification workflows
Details
What
Customer Technical Webcast: Bridging Connectivity and Thermal Modeling: i3D Integration with Calibre 3DThermal
When
Tuesday December 16, 2025
Where
Online
Time
18:00 hr CET
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