Surviving the Heat Wave
A presentation on Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies
This webinar will address issues at the IC, package, circuit board and system level where design changes made by the industry have had a significant impact on the thermal capabilities of the products. We will examine IC wearout, ceramic capacitors, EOS, bond wires, stacked die, solder phase coarsening, PCB materials, PTH fatigue, heatsinks and new methods for thermal transfer control.
Details
What
Surviving the Heat Wave: A presentation on Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies
When
Thursday the 27th of October 2016
5:00 PM - 6.30 PM CEST
8:00 PM - 9.30 PM CEST
Where
Online
This webinar will demonstrate how Sherlock can be used to accelerate the process of creating models for PCBs.
BluPrint-PCB WebinarOrganizations that demand high quality PCB Documentation be an integral part of their process realize shortened turn-around times, improved product quality, and overall reduced costs