Xpedition Advanced release webinar: Design complex PCBs faster, with greater first-pass confidence

 

Learn how Xpedition Advanced helps engineering teams replace disconnected handoffs with connected design intent, intelligent automation, earlier verification and manufacturing-aware workflows—creating a faster path to complex PCB designs with less manual iteration and greater first-pass confidence. 

 

 

 

Electronic system complexity has outgrown disconnected tools and “throw it over the wall” handoffs. Late discovery of performance, integration or manufacturing issues can lead to costly delays, redesigns and respins.

 

Siemens Xpedition Advanced helps multi-domain engineering teams design complex, performance-critical PCBs faster and with greater first-pass confidence. The solution connects design intent, constraints, collaboration, verification, mechanical integration and manufacturing-aware workflows across one integrated PCB design environment.

 

The integrated workflow supports:

• Mechanical–electrical collaboration across the design process
• Extended constraint definition and management for high-speed and rigid-flex designs
• Advanced routing automation for dense layouts, differential pairs and high-speed interfaces
• Integrated signal integrity verification, powered by HyperLynx, for deeper analysis including crosstalk, noise and timing
• Automated documentation, test-point placement and release preparation to improve readiness for fabrication and assembly
• Manufacturing-aware validation to identify buildability issues before release
• AI-enabled component and datasheet insights to support faster engineering decisions
• 3D panel visualization to improve material usage and manufacturing yield

 

What you will learn:

• Disconnected handoffs increase design risk, rework and schedule uncertainty as complexity rises.
• Connected design intent improves collaboration across electrical, mechanical, simulation and manufacturing domains.
• Advanced routing automation helps teams manage dense, high-speed and rigid-flex designs with less manual iteration.
• Integrated signal integrity verification helps identify performance issues earlier while designs are still flexible.
• Manufacturing-aware workflows improve buildability, traceability and release readiness.
• AI-enabled insights and automation help reduce manual iteration and improve first-pass confidence.

Who should attend:

This webinar is designed for professionals involved in developing high-speed, performance-critical electronic systems, including:

• PCB design engineers and advanced PCB designers
• Electrical and system engineers
• Engineering leads and chief designers
• Hardware development and design managers
• Signal integrity, power integrity and simulation engineers
• Mechanical engineers supporting ECAD–MCAD collaboration
• Manufacturing, DFM and test engineering professionals
• Technical directors and program owners responsible for schedule, quality and design risk

Join if your team is managing high-speed interfaces, dense routing, rigid-flex designs, growing design complexity or increasing pressure to improve first-pass confidence without adding headcount.

 

Details

 

What

Live webinar: Xpedition Advanced release webinar: Design complex PCBs faster, with greater first-pass confidence

 

When

Thursday, December 10, 2026

 

Where
Online

 

Time
07:00 PM CET