Competitive Advantage with Concurrent Engineering
Accelerate design time, reduce product development costs, and improve product quality with real-time concurrent engineering. With Xpedition technology, not only can all design tasks occur simultaneously but multiple individuals can contribute simultaneously to each task.
This white paper describes how tool- and flow-based concurrency can be used throughout the design process, including system design, schematic design, constraint management, and PCB layout.
Find out more here
Thermal design mistakes can be costly, leading to frustrating PCB re-spins and delayed product launches. Thermal teams are under constant pressure to move fast without sacrificing model credibility. This blog post offers a practical “cheat sheet” for thermal engineers working against aggressive schedules, highlighting five actionable tips to prevent common thermal design pitfalls and accelerate your time-to-market. For a deeper, step-by-step look at predicting component temperatures in real designs, you can download our white paper, 10 Tips for Predicting Component Temperatures.
What's new in Simcenter FLOEFD 2412?The new Simcenter FLOEFD 2412 software release is now available in all its CAD-embedded CFD versions, and Simcenter 3D embedded version. This release delivers electronics applications enhancements for PCB thermal analysis workflows.