What's new in Xpedition - Hyperlynx - Valor NPI 2510

The 2510 release marks a significant milestone in electronic design innovation, delivering powerful new capabilities across design, verification, and collaboration. With major enhancements to both Xpedition and HyperLynx, this release empowers teams to accelerate development, improve accuracy, and embrace next-generation design methodologies—including integrated 3D IC and chiplet-based workflows.

Xpedition 2510
The Xpedition 2510 release reinforces our vision of a scalable PCB design platform—one that adapts to every stage of growth, from individual innovators to global engineering organizations. Powered by the same trusted Xpedition technology, each tier offers cutting-edge performance, tailored to the needs and scale of your design team.
 
Featured Content: 
What's new in Xpedition 2510 on the Siemens website 

Download the release here
 
 
HyperLynx 2510
The latest HyperLynx 2510 release brings a rich set of enhancements across Schematic Analysis, AMS, DRC, Signal and Power Integrity, Advanced Solvers, and Enterprise Data Management. These updates deliver greater usability, accuracy, and integration to accelerate your electronic systems design verification and optimization. Let’s explore the highlights.
 
Featured Content:
What's new in HyperLynx 2510 on the Siemens website 

Download the release here
 

Valor NPI 2510
The Valor NPI 2510 release brings additional checks, better manufacturing awareness and exciting visual enhancements that show a significant evolution of the product offering. Valor NPI’s 3D view has been reimagined to make exploring Design for Manufacturing (DFM) results intuitive and precise.  
 
Featured Content:
What's new in Valor NPI 2510 on the Siemens website 

Download the release here
 
 
Support
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