Analog Mixed Signal Design in the PADS Product Creation Platform Webinar
Overview
PADS AMS Design Suite, part of the PADS product creation platform, enables PCB design engineers to produce designs with analog/mixed signals faster and easier while ensuring design intent performance, and reliability in a complete design capture solution and simulation / analysis environment.
The PADS AMS Design Suite solves the challenges associated with mixed-signal and mixed-technology circuits — behavioral verification, scenario and component optimization – with a simulation and analysis environment that seamlessly and accurately represents both its electronic and mechanical elements in a single-vendor solution.
What You Will Learn
- How to ensure intent, performance, and reliability of analog/mixed-signal (AMS) circuits
- Using a single environment and flow to help produce electronic product designs faster and easier
- The power and flexibility of combined VHDL-AMS and comprehensive SPICE simulation
- Using functions such as Monte Carlo and Sensitivity Analysis for faster design
- How to access Mentor Graphics’ complementary PADS AMS Cloud simulator
Who Should Attend
- Engineers designing PCB circuits/schematics
- Engineers who have wasted time and effort redrawing AMS circuits
- Anyone that needs to create, simulate, and validate mixed-signal and mixed-technology PC circuits
- Anyone that is interested in validating circuits for worst case, reliability, and optimization.
Details
What
Analog Mixed Signal Design in the PADS Product Creation Platform Webinar
When
Wednesday August 2, 2017
Where
Online
Time
4:00 PM - 5:00 PM CEST
This webinar, presented by Greg Caswell, will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCb warpage, the effects of improper curing and potential methods for correcting these situations.Finally, advances in superhydrophobic materials will be addressed to demonstrate the direction the industry is taking with respect to this topic.
TEC Lund 2017Join your colleagues at this premier industry event – featuring discussions and exhibits on advanced and emerging technologies in printed circuit board design, the current component situation, as well as the latest innovations within electronics assembly technologies.