Analyzing Via to Via Coupling Through PDN Cavities Using HyperLynx PDN Editor
Overview
At today’s signaling edge rates, crosstalk between vias passing through power/ground plane cavities can no longer be ignored.
This webinar explains the main root cause behind the via to via coupling phenomena. HyperLynx PDN Editor in Linesim is used to analyze how coupling occurs and how significant the crosstalk noise might be.
The Decoupling Wizard will be used for frequency domain analysis of the impedance profile of the PDN. Also, time domain simulations using the SI/PI Co-Simulation feature is performed to help the user understand the impact of this crosstalk noise.
Finally, the current mitigating techniques are evaluated to see how efficient they might be in reducing this crosstalk noise.
What You Will Learn
- Root cause behind via to via coupling
- Geometry creation of cavity with IC probes and vias.
- Frequency domain analysis of a cavity impedance profile using the Decoupling Wizard
- Time domain simulation of via to via coupling
- Techniques to mitigate coupling effects
Who Should Attend
- Electrical Hardware Design Engineers
- Power Integrity Engineers
- Signal Integrity Engineers
- PCB Design Engineers
- Board Layout Designers
- HyperLynx users
Details
What
Analyzing Via to Via Coupling Through PDN Cavities Using HyperLynx PDN Editor
When
Thursday the 29th of November 2018
Where
Online
Time
6:00 PM - 6:30 PM
Aspiring for agility, traceability, and regulatory compliance with your product-line engineering demands? Polarion Migration Center for DOORS can enhance your current deployment and allow you to capitalize on opportunities.
Changes to Electrolytic Capacitors - More Reliable?This webinar will discuss those changes, provide insight into the various failure mechanisms for electrolytic capacitors and describe appropriate accelerated tests to validate performance.