Calibre 3DSTACK: Bringing a 3rd Dimension to IC Verification
Join our introductory webinar, as we explore how Calibre 3DSTACK provides a fast and accurate way to perform die alignment and connectivity checking for 2.5D & 3D IC Designs.
The Calibre 3DSTACK tool extends Calibre die-level signoff verification to complete signoff verification of a wide range of 2.5D and 3D stacked die designs. Designers can run signoff DRC and LVS checking of complete multi-die systems at any process node using existing tool flows and data formats.
This 1-hour webinar is your chance to gain valuable insights into how to use 3DSTACK for your full stack verification when working with advanced packaging and multi-die package manufacturability. It is also an opportunity to have your questions answered by our experts.
What You Will Learn:
- An overview of 3D IC Technology
- 3DSTACK's capabilities, flows and the benefits it offers
- Expert insights into configuration and rule deck utilization
- Assembly layout generation processes
Who Should Attend?
- Designers and CAD engineers specialized in design, verification & manufacturing processes. Everyone interested in the practical application of Calibre 3DSTACK and multi-die verification
- Calibre 3DSTACK
Customer Technical Webcast: Calibre 3DSTACK: Bringing a 3rd Dimension to IC Verification
Wednesday, November 29, 2023
18:00 hr CET
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