Common Mistakes by Electronic Design Teams (Part 2)
Electronic system design is a multilevel engineering exercise. It requires synergy between software, electrical and mechanical engineers with the goal to create a system that meets customer requirements while remaining within budget and on time.
The propagation of electronic systems has been extremely successful. Many historically non-or-limited intelligence constructions are incorporating an increasing amount of sophisticated technology. As an example, many fuel pumps contain single board computers whose sole purpose is credit transactions. Some companies doing positive train control (PTC) use ARM/RISC and ATOM based computer modules. And Internet of Things (IoT) space (ex. mobile gateways) and autonomous transport will soon implement complex electronic systems into all aspects of the industrial eco-system.
However, all this success can tend to mask the challenges of designing a successful electronic system. These challenges are expected to increase dramatically with the integration of embedded systems into IoT applications, where environments can be much more severe than standard home / office installations.
This two-part webinar presents the fundamentals of designing a reliable electronic system and the most common pitfalls encountered by the system designer.
Part 1 was presented by Craig Hillman on Thursday, January 19, 2017, reviewed the early stages of the new product development process, including ‘Who Controls What?’, Make vs Buy, Choosing the Right Size, Mitigating Thermal Issues, Reliable Part Selection, and Resolving Power Sequencing. This webinar was recorded and will be available soon if you missed it.
Part 2 of this webinar will focus on mechanicals and reliability, including Design Rules for Connectors, Identifying Housing Challenges, Rules of Thumb for Reliability, and Physics of Failure.
In Part 1, presented by Craig Hillman, will review the early stages of the new product development process, including ‘Who Controls What?’, Make vs Buy, Choosing the Right Size, Mitigating Thermal Issues, Reliable Part Selection, and Resolving Power Sequencing.Implementing Physics of Failure into the Design Process
Unique seminar where Dr Craig Hillman will introduce you how PCB reliability analysis challenges are solved by Sherlock, CAE software which is based of Physics of Failure (PoF)