EOS Failures in ICs - Symptoms, Causes and Prevention
The semiconductor industry has witnessed a steady growth for the last few years thanks to emerging applications. The industry is at an inflection point where emerging applications are driving the growth of major semiconductor components such as memory, microprocessors, sensors and analog devices. Reliable operation of these components is very important in any given application. In order to ensure reliability, the parts get extensive testing and burn-in. In spite of that, Integrated Circuit (IC) failures are inevitable. One of the common failure mechanism that affects IC components irrespective of the type of application is electrical overstress (EOS). It affects the component without prior warning, like an earthquake. When it hits, the damage is done and the functionality cannot be recovered.
EOS can be mitigated at both the component and system level. But, for a vast majority of end users, OEM’s and Tier 1’s, it is a misapplication issue which is best addressed at the system level. EOS failures are inadvertent in any system and following design guidelines is critical in mitigation.
In this webinar, we will be focusing on the symptoms, causes and prevention methods to address this very important failure mechanism affecting IC components.
Details
What
EOS Failures in ICs - Symptoms, Causes and Prevention
When
Thursday the 27th of September 2018
Where
Online
Register
This webinar will demonstrate that assessing board-level reliability and computing lifetime predictions, with casing and other mechanical constraints incorporated, is pertinent to successful products.
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