From 3D IC Basics to Advanced DRC and LVS Features

(Episode 1)

 

Overview

 

During Episode 1, you will learn how Calibre 3DSTACK provides fast and precise die alignment and connectivity checking for 3D IC designs. 

  

 

 

 

During Episode 1, you will learn how Calibre 3DSTACK provides fast and precise die alignment and connectivity checking for 3D IC designs, enabling comprehensive signoff verification for 2.5D and 3D stacked die systems with advanced DRC and LVS capabilities.

 

What You Will Learn:

• Overview of 3D IC technology
• Capabilities and flows of 3DSTACK
• Expert insights on configuration and rule deck optimization
• Assembly layout generation processes
• Advanced features of 3DSTACK

Who Should Attend:

• Designers and CAD engineers involved in design, verification, and manufacturing processes
• Anyone interested in the practical application of Calibre 3DSTACK for multi-die verification.

Products Featured:

• Calibre 3DSTACK
• Calibre nmDRC and nmLVS
• Calibre PEX
• Calibre PERC

 

Details

 

What

Customer Technical Webcast: From 3D IC Basics to Advanced DRC and LVS Features (Episode 1)

 

When

Thursday September 19, 2024

 

Where
Online

 

Time
18:00 hr CEST