Guarantee Reliability with Thermal Cycling
This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided.
We will discuss the usage of analytical and semi-analytical prediction methodologies.
Webinar: Guarantee Reliability with Thermal Cycling
Thursday, the 14th of December 2017
Including thermal analysis early in a design process has proven to be the preferred approach in delivering the best design in the shortest amount of time. As the electrical and mechanical designs develop early in the design process the thermal analysis evolves as more information is integrated into the thermal model. Later in the design process, when ECAD data is available a more detailed approach to PCB modeling can be considered.What is Coming in Sherlock 6.0?
In a world where electronics are being more closely integrated to all objects, such as wearables, drones, internet of things (IoT), and complex mechatronics, the interaction with the real world becomes increasingly critical to the reliability of circuit card assemblies.