How a streamlined simulation and test approach enhances electronics reliability
The increase of semiconductor content in electronics systems has been an emerging trend in consumer electronics, white goods, automotive and aerospace industries. The latest packaging technologies allow the integration of increasingly high computing power in a single package. This creates thermal and mechanical design challenges on both the package and the PCB board levels. Similarly, power semiconductor components often used in power conversion such as electric traction applications are changing too. They switch increasing amounts of power while maintaining the same package footprints. Besides thermal reliability, shock and vibration-related reliability of the PCB or the component itself is a concern, especially in industrial or vehicle electrification settings.
At Siemens, we combine electrical and mechanical design domains in one seamless flow. Board design data can directly be imported into our mechanical design solutions. This allows mechanical designers to run quick yet accurate simulations to verify the feasibility of a design at an early stage, eliminating the need for physical prototyping.
This webinar will demonstrate how ECAD data can be brought into the mechanical environment and how our simulation tools can support thermal, structural, and modal analysis of the board or subsystem. We will show a test-based approach that can calibrate the thermal model of selected high-power components, but at the same time also estimates the power cycling lifetime.
You will learn:
- How electrical and mechanical engineers can work together to virtually validate early designs.
- How designers can perform simple yet accurate CFD analysis of an electronics system.
- How to perform structural and modal analysis of the PCB designs.
- How testing can further increase the accuracy of modeling and help calibrate material parameters.
- These topics will be explored using the example of a Siemens Nanobox.
Live webinar: How a streamlined simulation and test approach enhances electronics reliability
Thursday the 26th of January 2023
19:00 - 20:00 hr CET