Reballing Process Controls and Cleanliness
The electronics assembly market has experienced a material shift from lead (Pb) based solders to Pb-free solders. This is a result of the widespread adoption of Reduction of Hazardous Substances (RoHS) legislation and practices in commercial industry. As a result, it is becoming increasingly difficult to procure commercial off-the-shelf (COTS) components with tin-lead (SnPb) solder balls or finish.
There are essentially three responses to the scarcity of acceptable SnPb parts: custom order, post process or adapt. And each has its own reliability risk.
This webinar presents results regarding several package types from tin-silver-copper (SAC305) solder to SnPb eutectic solder. It is important to understand the reliability risks associated with the reballing procedure, particularly as it relates to thermal cycling, shock and vibration environments.
| What | Reballing Process Controls and Cleanliness |
| When | Thursday, the 18th of December 2014 |
| Presenter | Greg Caswell, DfR Solutions |
| Where | Online |
| Duration | 1,5 hour |
| Time | 5:00 PM - 6:30 PM CET - Register |
| Time | 8:00 PM - 9:30 PM CET - Register |
This presentation will explain how to define environments in Sherlock as a life cycle. Each project has a defined life cycle that includes all the load phases for the boards in the project
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