Reballing Process Controls and Cleanliness
The electronics assembly market has experienced a material shift from lead (Pb) based solders to Pb-free solders. This is a result of the widespread adoption of Reduction of Hazardous Substances (RoHS) legislation and practices in commercial industry. As a result, it is becoming increasingly difficult to procure commercial off-the-shelf (COTS) components with tin-lead (SnPb) solder balls or finish.
There are essentially three responses to the scarcity of acceptable SnPb parts: custom order, post process or adapt. And each has its own reliability risk.
This webinar presents results regarding several package types from tin-silver-copper (SAC305) solder to SnPb eutectic solder. It is important to understand the reliability risks associated with the reballing procedure, particularly as it relates to thermal cycling, shock and vibration environments.
|What||Reballing Process Controls and Cleanliness|
|When||Thursday, the 18th of December 2014|
|Presenter||Greg Caswell, DfR Solutions|
|Time||5:00 PM - 6:30 PM CET - Register|
|Time||8:00 PM - 9:30 PM CET - Register|
This presentation will explain how to define environments in Sherlock as a life cycle. Each project has a defined life cycle that includes all the load phases for the boards in the projectImproved Efficiency & Reliability for Servers Using Immersion Cooling Technology
Data centers have traditionally been high power consumers. In a “green” data center, instead of being air-cooled, servers are submerged in a non-toxic dielectric fluid that is 1200 times more effective at whisking away heat. By using state of the art liquid immersion cooling, the power required to run each server is reduced by up to 50% and the power required to cool a server room is reduced by up to 90%. For perspective, power costs represent from 25-40% of monthly data center operating expenses. Any energy expended other than that to drive the IT Load contributes to inefficiency.