System Level Effects on Solder Joint Reliability
Electronic systems may often fail, not because of poorly designed chips, substrates or other components, but because of the failure of the solder joints that link them all together. The mismatch between PCB solder materials can result in thermal expansion problems including excessive strain, cracking and open circuits. The impact of thermal fatigue, soldering defects, vibration and residual strains must be considered when analyzing solder reliability. These and other issues are often exposed in accelerated stress tests.
The most common method for testing solder joint reliability is thermal cycling where the thermal modulation process mimics environmental strains. But other testing methods including power cycling, HALT, shock and vibration can expose potential metallurgical and physical failures.
In this webinar DfR Solutions Research Engineer, Maxim Serebreni, PhD, will discuss Thermo-mechanical fatigue of solder interconnects, shear and tensile effects, glass style, improper conformal coating, and mirroring on solder fatigue. He will also review the Physics of Failure methodology and solder alloy selection approach.
Dr. Serebreni is an expert in experimental mechanics and mechanical characterization of non-ferrous metallic alloys.
Details
What
System Level Effects on Solder Joint Reliability
When
Thursday the 17th of August 2017
Where
Online
Register
We would like to invite you for the D&E Event Den Bosch.
Coatings and Potting - A Critical UpdateThis webinar, presented by Greg Caswell, will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCb warpage, the effects of improper curing and potential methods for correcting these situations.Finally, advances in superhydrophobic materials will be addressed to demonstrate the direction the industry is taking with respect to this topic.