Vias and Stackups: the Design within the Design
This webinar will show you how to evaluate PCB tradeoffs and create a detailed board model that ensures that the detailed design simulations you perform reflect the behavior of the board as it will actually be built, instead of reflecting the behavior of a board as you wish it could be built.
Via Planning for non-Dummies
As signaling speeds continue to increase, via design and planning are becoming a significant part of the process of designing for signal integrity.
We all want simulators that can model detailed electromagnetic behavior and produce highly accurate results, but what happens if you build something different than what you simulated? While no one does that deliberately, the fact is – it happens all the time because the details of the materials and processes used to build the board aren’t accurately represented in the simulation model.
As speeds go faster and margins get smaller, the small details of board fabrication – like plating layer thickness, or metal roughness on core vs. prepreg vs. plating surfaces – can significantly impact design performance. In order to ensure simulation results are accurate, it has become critical to model and analyze a board as it will be manufactured – instead of using traditional methods.
What you will learn:
- How via planning impacts signal integrity
- Via planning as part of the stackup design process
- Vias in the PCB fabrication process
- Via types and construction requirements
- How to ensure your PCB stackup is real, before running simulations
Who should attend:
- SI & PI specialists looking to make their simulations more accurate
- Hardware system designers looking to accelerate their design's transition into manufacturing
- New Product Introduction (NPI) engineers working with PCB fabricators
- Hardware design managers looking to improve the interface between design & manufacturing
Details
What
Live Webinar: Vias and Stackups: the Design within the Design
When
Thursday, September 5, 2024
Where
Online
Time
16:00 hr CEST
The PCB Forum will demonstrate how Siemens is enabling electronic engineering teams to overcome today’s challenges and with the latest innovations.
Polarion4U Days 23-24 September 2024The Polarion user conference is a highly anticipated event that brings together a divers community of users, experts, and enthusiasts from around the world.