We're happy to announce that the VX.2.6. Release of Xpedition, PADS Professional, HyperLynx and IC Package Design is now available at Support Center.

What’s New in Xpedition® - VX.2.6
The latest releases of Xpedition address the increasing complexity of today’s advanced system designs through an emphasis on both ease-of-use and team productivity. More info can be found here.

What’s New in PADS VX.2.6?
PADS Professional VX.2.6 focuses on enhancements to the core technology, many of which have been suggested by you through Mentor Ideas. More info can be found here.

What’s New in HyperLynx® - VX 2.6
The latest releases of HyperLynx address the increasing complexity of today’s advanced system designs through an emphasis on both ease-of-use and team productivity. More info can be foud here.

What’s New in Xpedition IC Packaging
Mentor's Xpedition IC Packaging tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design. More info can be found here.

Via SupportCenter you can check all the VX.2.6. Release Notes and downloads.

For more information please call us or send us an email info@innofour.com