What's new in Simcenter FLOEFD 2606? CAD-embedded CFD simulation
Blog by Chris Watson and Peter Doughty
The new Simcenter FLOEFD 2606 software release is now available in all its CAD-embedded CFD variants, and also the Simcenter 3D embedded variant. This release delivers focused improvements for electronics cooling analysis.
This includes library enhancements for easy validated component re-use, efficient modeling of power sources on a die to identify hotspots for IC packages in system models, improvements to computationally efficient PCB thermal modeling, automation of EDA data import, and much more.
This release delivers focused improvements for fast sealing of geometry for internal flow analyses for all general purpose CFD applicationstrough to multiple enhancements for electronics thermal analysys workflows.
- Smart Die - modeling 1000's of power sources
- Smart PCB: FEM mesh based thermal analysis
- Library enhancements
- Material Priority setting
- EDA Bridge automation - headless operation
- Automation: other API enhancements
- Speed-up: 100's of 2R components contacting a Smart PCB
- XTXML export enhances package model workflows
Read the blog here.
Users can download all variants on Support Center.
This update brings a focused set of enhancements designed to improve everyday work with Polarion, with improvements across AI-assisted workflows, user experience, multilingual collaboration, and platform quality.
Reimagine productivity with the secure, cloud-based PADS Professional App SuiteThe PADS Professional App Suite enables digital transformation by providing PADS Professional users a flexible, open ecosystem that connects component research, concept exploration, component sourcing, design and analysis management, and manufacturing.