HyperLynx Fast 3D Solver

HyperLynx® Fast 3D Solver enables efficient, full package model creation with multi-processing for faster turnaround time. It is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model generation while accounting for skin effect impact on resistance and inductance.

Fast solver technologies enable rapid simulation on single and multiple cores. It is 20x-100x faster than other equivalent solutions and maintains full-3D gold-standard EMQS accuracy. The intuitive GUI enables users working with the latest system-in-package (SiP), package-on-package (PoP), stacked die, and multi-chip module (MCM) scenarios to easily extract accurate models with minimum extraneous effort on boundary conditions and port definitions.

Whether the specific application is related to a high-performance microprocessor design, a low-cost ASIC and system design, power integrity, signal integrity, or simultaneous switching noise, effective solutions are available for all design types.

• Loss modeling: capture the DC and skin-depth based high-frequency behavior of resistance and inductance.
  
  
• Tight integration with existing design flows plus quasi-static 3D SI and PI solution in the same software framework.
  
  
• Simultaneous switching analysis including simultaneous handling of power and signal nets of significantly different impedance.
  
  
• Features GDS, package and board import capability from all industry standard formats as well as intuitive and fast 3D model merging and combining utilities within an integrated workspace.
  
  
• Broadband behavior is represented using a single frequency-independent circuit in the output SPICE mode.
  
  
• A deep IP and rich feature list enables users to choose from multiple extraction modes and design-critical features.
  
  
• Obtain impedance, resistance, conductance, capacitance, inductance, and complete SPICE netlists, with or without skin-effect frequency dependence, place chip layers and multiple packages and package types on boards and observe electrical behavior through the integrated chip through system.
  
  
• Directly imports geometry in widely used CAD formats and produces output models that are compatible with standard circuit simulation engines.
  
  
• Rapidly and accurately extract reliable and complete SPICE models in a fully automated manner for a variety of applications including chip interfaces, redistribution layers, packages, boards, systems, and SiPs.