Calibre 3DStress: Die Level Stress Simulation for 3D IC Reliability Validation
Overview
Join us at this free Expert Series Webinar to explore how Calibre 3DStress enables die and chiplet designers to validate chip reliability within the context of the package, providing crucial insights into stress-related issues before manufacturing
As 3D IC packaging becomes more complex, thermo-mechanical stress poses significant challenges to chip reliability. In this webinar, we will explore how Calibre 3DStress enables die and chiplet designers to validate chip reliability within the context of the package, providing crucial insights into stress-related issues before manufacturing.
What you will learn:
- How to identify and analyze thermo-mechanical stress impacts in 3D IC packaging
- Methods for performing comprehensive die-level stress simulation and warpage analysis
- Techniques for stress back-annotation and results interpretation
- Best practices for early reliability validation in the design process
Who should attend:
- IC Design verification engineers
- IC reliability engineers
- 3D IC integration specialists
- Package design engineers
Details
What
Customer Technical Webcast: Calibre 3DStress: Die Level Stress Simulation for 3D IC Reliability Validation
When
Wednesday July 30, 2025
Where
Online
Time
18:00 hr CEST
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