20 March 2018

E-18 Odense

We are happy to announce that we will again participate at the E-18 Denmark's absolutely largest electronics trade fair, that will take place in the Odense Congress Center.


You can find us in Hall C, at booth 3636

Visit our booth and find out about all the new and interesting features of e.g. Mentor PADS and Xpedition, Omnify's Empower PLM, Polarion from Siemens PLM Software.


Technical Seminars hosted by InnoFour

This edition we host 5 free technical seminars at Tuesday, Wednesday and Thursday in Hall C. See beneath an overview of the scheduled seminars. And of course, the presenters will be available for all your questions.

Tuesday 11th of September:

Time: 14.20 - 14.50 hr; Sensor/Industri 4.0 - Hal C

'Thermal Analysis for Electronics Design' by Michael Kasperski, Mentor Graphics, A Siemens Business

Abstract: The managing of the heat dissipated in electronics has long been recognized as a major challenge. As functionality has increased, following Moore’s Law, the associated heat dissipation has escalated, to the extent that this has been recognized as a potential limitation on the pace of electronics development. The challenge is to prevent overheating, and failure, of critical components via appropriate cooling strategies. By providing a means of predicting and improving the thermal performance of electronics equipment, CFD-based software has supplied an invaluable design aid in meeting these challenges

Wednesday 12th of September:

Time: 13:40 - 14:10 hr; EHPComputing (Al i embedded / FPGA - Hal C

'Polarion ALM, Everything you need to accelerate innovation' by Yehoshua Shoshan, InnoFour.
Abstract: As a result the use of embedded software is quickly infringing on hardware’s dominance in the product development process. However in many environments software development is a siloed activity that leads to disconnects between product requirements and implementation that leads to product recalls or product failures. In legacy software development environments, many different point solutions are used to manage the application lifecycle. As a result, development artifacts are scattered, slowing down collaboration, hindering transparency, undermining integrity and making it difficult to drive innovation. This presentation will cover the challenges in today’s embedded software development and how we can help organizations with a unified solution that divers project transparency through real-time aggregated management information. It enables everyone to be aligned around what is being built and why, to drive advancement while protecting integrity and compliance. This approach helps teams respond faster and with better quality to new business opportunities and customer demands.


Thursday the 13th of September


Time 13:00 - 13:30 hr - Hal C

'Mitigating Thermal Mechanical Risks in the Electronics Industry' by Dr Natalie Hernandez, DfR Solutions.
Abstact: Electronic and mechanical engineers have long lived in separate worlds, with separate tools and languages, and communication between them has often been a challenge. How can we make sure both sides are in sync and can communicate changes efficiently?


Time 13:40 - 14:10 hr; Hal C

'How PLM Can Help Smaller Businesses to Thrive' by Jesper Månsson, InnoFour

Abstract: Come and listen to our presentation about Omnify PLM which is Engineering driven, with no consulting and implementation in days or weeks, not months or years. Internet of things (IoT) is becoming the way of the world and because of it, there are now more components being manufactured and more intricate design chain challenges than ever before. For small and medium sized enterprises (SMEs), who typically don't know where to start or have the required time and expertise to implement a PLM system into their processes, surviving this age of digital transformation can seem like a overwhelming amount of data crashing down.


Time 14:10 - 14:40 hr; Produktboksen - Hal C
'Live Demo: Collaboration between electronic and mechanical engineering' by Lennart Edenfjord, InnoFour

Abstract: If you are constructing a compact design, you’ll want to make sure you are utilizing the space available as efficiently as possible when laying out your PCB. If your product is a big spacious box, there are still mounting points to keep track of. One mistake is all it takes to make a PCB incompatible with the mechanics. In this presentation we will examine the tools and methods available to engineers today to keep the electronic and mechanical domains in sync and avoid expensive respins..





E-18 Fair



11th till 13th of September 2018



Odense Congress Center, Ørbækvej 350, 5220 Odense SØ Denmark