Fans 101 - An Introduction to Fans in Electronics Cooling Applications
Overview
During this presentation, we will discuss three fan types typical in electronics cooling applications; centrifugal, radial and axial. We will explain how fan curves are experimentally determined and how that is represented in FloTHERM and FloTHERM XT. FloTHERM XT will be used to explicitly model the rotating fan blades in a system level model. Engineers involved in board and chassis design would find this session very educational.
Also, FloTHERM XT’s rotating geometry feature will be demonstrated to accurately determine flow distribution in a system level model.
What You Will Learn
- What fan types are used in electronics cooling applications
- How fan curves are determined experimentally
- What are the pros and cons of using a Black Box model of a fan in a simulation
- How to use FloTHERM XT to model the rotating blades of a fan in a system level analysis
Who Should Attend
- Engineers who have thermal problems with electronic based applications
- Technical Managers
- Thermal Engineers
- Board and Chassis Engineers
About the Presenter John Wilson
John Wilson joined Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) after receiving his BS and MS in Mechanical Engineering from the University of Colorado at Denver. Since joining in 1999, John has worked on or managed more than 70 thermal and airflow design projects.
His modeling and design knowledge range from component level to Data Centers, heat sink optimization and compact model development. John has extensive experience in IC package level test and analysis correlation through his work at Mentor Graphics' Fremont based Thermal Test Facility.
He is currently the Electronics Product Specialist, in the Western Region, for the Mechanical Analysis Division.
Details
What
Fans 101 - An Introduction to Fans in Electronics Cooling Applications
When
Thursday April 27, 2017
Where
Online
Time
12:00 PM - 12:45 PM CEST
Reliability expert and author Lloyd Condra will provide his fascinating insights during this webinar. After experience as a technical fellow at Boeing and ASQ Reliability Division, Condra recently joined DfR Solutions as an advisor of electronics manufacturing. He has contributed to multiple academic studies including Reliability Assessment of Aerospace Electronic Equipment, and he is highly sought after for his knowledge of military defense systems. He has authored 2 books, Reliability Improvement with Design of Experiment and Value-added Management with Design of Experiments and published over 40 technical papers.
Simulation Based Characterization: A 3D to 1D System Level Thermo-Fluid CFD Workflow3D CFD offers a unique and cost effective approach to characterize multi-arm geometries for use in system simulations. As an alternative to physical test bench methods, the CFD capabilities of FloEFD can simulate complex flows in 3D geometries. The highly 3D interacting nature of the flow can be resolved, without having to resort to assumptions or text book relationships.