The electronics industry is well into its second decade working with increased environmental sensitivity. Some of the driving forces are statutory such as RoHS and WEEE and some are voluntary such as halogen free. Some of the efforts to change toward more environmentally aligned materials and processes were initially seen as one-time events or projects. It's now clear that environmental considerations need to be permanently integrated into requirements, design, production, servicing, and disposal. Regulatory requirements and customer expectations will both be increasing and companies need to plan for increased materials becoming in scope and decreased ppm levels becoming required. In this webinar we will address these important issues.
Tuesday the 24th of September 2015
- 5:00 PM - 6.30 PM CEST
- 8:00 PM - 9.30 PM CEST
This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided. We will discuss the usage of analytical and semi-analytical prediction methodologies.Hands-on HDI workshop
First, you will be given an introduction to the principles of HDI and introduced to Mentor Xpedition, which is the platform used in this workshop. This is NOT a Mentor Graphics Tool Training Class – the principles can be used on all PCB design platforms. Therefore, you do not have to know Xpedition to attend this workshop.Once you know the principles and the system, the fun begins! The rest of time, you will be able to experience HDI capabilities first hand by working at a workstation to practice connecting three advanced BGA’s using HDI-Microvias and then routing these HDI breakouts