Guaranteeing Reliability with Thermal Cycling
This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided. We will discuss the usage of analytical and semi-analytical prediction methodologies.
Details
What
Guaranteeing Reliability with Thermal Cycling
Presenter
Nathan Blattau
When
Tuesday the 10th of September 2015
- 5:00 PM - 6.30 PM CEST
- 8:00 PM - 9.30 PM CEST
Where
Online