
Signal Integrity and Advanced System Design by Lee Ritchey (3 days)
InnoFour and EE-Training invites you to participate in some very exiting courses this summer in Stockholm. The 'must have'3-days Signal Integrity and Advanced System Design training with Lee Ritchey the Mr. High Speed of Silicon Valley. The training will take place from 10 - 12 June 2013 in the Courtyard Stockholm Kungsholmen, Stockholm, Sweden.
This highly practical course is designed to take the student through the entire process involved in designing and fabricating high speed PCBs. It begins with the fundamentals of electromagnetic fields and the behavior of transmission lines that are the basis for all high-speed signaling. From there, it examines all of the aspects of high-speed design leading to the development of a robust set of PCB design rules that accounts for power subsystem design, routing rules and design of PCB stack-ups as well as the fabrication rules needed to balance performance against cost and manufacturability.
You learn about:
- Handling of 1000s of multigigabit signals in terabit routers
- Design of a board for a hard drive passing EMC testing
- How an X-Box 360 uses a 4 layer board with two 1500+ ball BGA packages
- Failures from crosstalk and reflections
- Problems related to time delays in PCB traces
- EMI failures
- Failures stemming from poor power system design
- Failures related to poor IC package design
Practical Details
- When: Monday June 10th to Wednesday June 12th, 2013
- Time: 9:00 to 16:00 all 3 days
- Where: Courtyard by Marriott Stockholm, Rålambshovsleden 50
- Price: EUR 1.925 (using the promo code MG338 before April 2nd 2013)
- If you register after April 2nd, 2013 the price is: EUR 2.153
More information and sign-up on-line: www.ee-training.dk
Mentor Forum for PCB is designed to bring you up to speed on all of the latest capabilities within the DxDesigner, Expedition Enterprise and HyperLynx releases.
Stackup Design by Lee RitcheyToday’s high-speed PCBs, with their inherent signal integrity and power delivery requirements, make it necessary to employ far more discipline in the choice of materials and the arrangement of layers in the stackup. These requirements are outside the skill set of all PCB fabricators. The objective of this course is to guide the design engineer through the process of evaluating and selecting the right laminate for any given design and then designing a PCB stackup that meets the numerous requirements of a complex, multilayer board that works right the first time