The Reliability of BGA, QFN and Other Critical Packages
There are many factors that determine the thermal cycling robustness of an electronic package. Packages that have known thermal cycling issues include BGAs, QFNs and ceramics.
In this presentation, Nathan will discuss the critical parameters of these packages that may affect the thermal cycling performance. The webinar will also cover other possible reasons why your electronic product may not be robust with regards to thermal cycling.
- Review the package types that are the most susceptible thermal cycling fatigue
- BGA packages
- QFN packages
- Ceramic components
- Effects of lead frame material on plastic packages
- Other factors to consider when designing a thermal cycling robust electronic product
Web Seminar: The Reliability of BGA, QFN and Other Critical Packages
Thuesday the 30th of April 2019
At his seminar we will show some examples of board and chassis level waterproofing approaches. The board level methodologies reviewed will be potting, conformal coating, and hydrophobic coatings. For the chassis level the usage of LSR, FIPG, and foam gaskets will be discussedCAM350 Technical Webinar
Attend this CAM350 webinar to experience our software designed to analyze, verify, and optimize a PCB design for successful fabrication. Plus, you will also witness the new features and functionality that came with Release 2018.