Determining the water protection requirement for a device is the first step in waterproofing. The first portion of this webinar will discuss the differences/commonalities between IP and NEMA water protection ratings. This webinar will then discuss some PCBA level and Chassis level waterproofing schemes.
Michael will show some examples of board and chassis level waterproofing approaches. The board level methodologies reviewed will be potting, conformal coating, and hydrophobic coatings. For the chassis level the usage of LSR, FIPG, and foam gaskets will be discussed.
Finally, Michael will discuss the issue of condensation and possible mitigation methods.
- Water protection levels and what they mean
- Types of waterproofing schemes
- Potential issues
Web Seminar: Waterproofing Electronics
Thursday the 18th of April 2019
This live webinar will demonstrate how you can solve analog mixed-signal design challenges for increased reliability and faster product development with AMS in PADS Professional.The Reliability of BGA, QFN and Other Critical Packages
In this presentation, Nathan will discuss the critical parameters of these packages that may affect the thermal cycling performance. The webinar will also cover other possible reasons why your electronic product may not be robust with regards to thermal cycling.