Understanding the Reality of New, High 'Reliability' Solders
For a long time, the electronics world only had to deal with SnPb (eutectic or high Pb). With the movement to RoHS over 15 years ago (how time flies!), three more solder alloys became prominent in the electronics world (SAC305, SN100C, and SAC125Ni).
However, with increasing concern over thermal cycling and the need for hotter electronics in electrified systems (such as electric cars, solar power, and microgrids), there is increasing interest in ‘high reliability’ solders. Initially sparked by the introduction of Innolot through a European consortium, each major solder supplier now has their own ‘high reliability’ alloy.
But what does ‘high reliability’? Thermal cycling? Vibration? Shock? Is it manufacturable? Is it controllable? In this insightful and unique webinar, DfR Solutions will attempt to pull back the curtain and reveal what is actually known about the performance of these new tin-based alloys and whether they are a right fit for your design and your organization.
Details
What
Understanding the Reality of New, High 'Reliability' Solders
Presenter
Craig Hillman
When
Thursday the 25th of February 2016
5:00 PM - 6.30 PM CEST
8:00 PM - 9.30 PM CEST
Where
Online
The Omnify Software User Conference provides an opportunity for Omnify Software customers and partners to experience an unparalleled training event over the course of two days. From beginner to seasoned-there is training for every level of user
Predicting Component Warpage and Package Level Failure ModesPackage technology is constantly improving in order to keep up with the advances in silicon technology. Multi layered packages exhibit several failure modes that can be predicted using modern software tools. This paper provides a methodology for creating a high-fidelity model of the interposer with all the conductor geometries. The two failure modes that are explored with this model are package warpage prediction due to actual copper imbalance and filled microvia delamination